Micron Begins US$9.3 Billion Japan Semiconductor Fab Expansion

---

Written by Eric Funderburk for IIR News Intelligence (Sugar Land, Texas)

---

Summary

Micron has begun a US$9.3 billion expansion of its semiconductor fab in Hiroshima Prefecture, Japan, and has other substantial construction investments underway in the U.S. and Singapore.

---

Expansion Kickoff

It's a good time to be a major semiconductor manufacturer. Companies such as Intel, Taiwan Semiconductor Manufacturing and Micron Technology are pouring hundreds of billions of dollars into the development and expansions of semiconductor fabrication facilities (fabs). Government subsidies are rolling in to encourage domestic chip development, something very much seen in the latest blockbuster semiconductor project to kick off: Micron Technology's US$9.3 billion expansion of its semiconductor fab in Hiroshima Prefecture, Japan, which the Japanese government is supporting with up to approximately US$3 billion.

The Japanese plant will allow Micron to manufacture the latest DRAM (dynamic random access memory) chips and high-bandwidth memory (HBM), essential components for AI processing. Industrial Info Resources data show the project involves adding new front-end and back-end production and assembly lines, along with support systems and utilities, and is expected to be completed toward the end of 2028.

Other Micron Construction

But the Japan project is only Micron's latest undertaking. The company is spending billions more dollars on active construction for fabrication facilities in New York, the company's home state Idaho and Singapore.

Micron is dropping $25 billion to expand its fab complex in Boise, Idaho, by constructing a new fab facility along with hundreds of thousands of square feet dedicated to support, utility and administrative buildings. Following that fab's completion in 2027, in 2028 Micron is expected to begin work on another Boise fab with support facilities, doubling its $25 billion investment.

Micron earlier this year broke ground on the first of four planned fabs near Syracuse, New York, which will lead to total investments of approximately $100 billion once all work is completed, which isn't expected until the early 2040s. The under-construction Syracuse Fab 1 is expected to be completed in early 2030, followed by Fab 2's completion in 2034, with the third and fourth fabs coming online later.

Micron also is investing substantially in Singapore to increase production of NAND flash memory chips that are used in items such as solid-state drives and smartphones as they retain memory without power.

Key Takeaways

• Micron Technology has broken ground on a US$9.3 billion expansion of its semiconductor fab in Hiroshima Prefecture, Japan.
• The expansion will allow for the manufacture of DRAM and HBM technologies.
• Micron also is investing substantially in plants in Idaho, New York state and Singapore.

---

About Industrial Info Resources
Industrial Info Resources (IIR) is the leading provider of industrial market intelligence. Since 1983, IIR has provided comprehensive research, news and analysis on the industrial process, manufacturing and energy related industries. IIR's Global Market Intelligence (GMI) helps companies identify and pursue trends across multiple markets with access to real, qualified and validated plant and project opportunities. Across the world, Industrial Info Resources is tracking over 250,000 current and future projects worth $30.2 trillion (USD).