Intel Plans Groundbreaking for a $2 Billion 300 mm Wafer Fab Plant in Oregon

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The following is an advisory by Industrialinfo.com (Industrial Information Resources, Inc: Houston, Texas). Intel Corporation (NYSE: INTC) (Santa Clara, Ca.) is stepping up the pace in 300 millimeter (mm) wafer fab (board) production, despite a slowdown of sales in the personal computer markets. The world's largest chip maker is aggressively pursuing mass production of 300 mm (approximately 12-inch) wafers using its 0.13 micron technology. The company plans to break ground this October for a wafer fab plant called D1D, in Hillsboro, Oregon that will mass produce 300 mm wafers. The new facility will enable Intel to take advantage of high-volume manufacturing of silicon using advanced 0.13 micron process technology. The 300 mm wafer offers 240% more area for computer chips over today's standard 200 mm (approximately 8-inch) wafer.

The $2 billion manufacturing facility is planned to come online in late 2003 and class 10 clean rooms will account for more than 100,000 square feet of the overall one million square foot facility. According to Intel, on a production unit basis, 300 mm wafer manufacturing will use 40 percent less energy and water per chip than a 200 mm wafer plant. Ultimately, production costs will be lowered and product output will more than double.

Intel, the worlds largest chip maker, is also a leading manufacturer of computer, networking and communications products. Revenue for the second quarter of 2001 was $6.3 billion, down 24% for the same period last year. The company expects capital spending for 2001 to be approximately $7.5 billion.