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Intel Moves Forward with Two Semiconductor Manufacturing Projects in Rocky Mountain Region

Through continuous investments in its facilities and production processes, Intel has continued remain ahead of the market trends, consumer demands and its competitors

Released Thursday, November 04, 2004

Intel Moves Forward with Two Semiconductor Manufacturing Projects in Rocky Mountain Region

Researched by Industrialinfo.com (Industrial Information Resources, Incorporated; Houston, Texas). Intel Corporation (NASDAQ:INTC)(Santa Clara, California) is currently proceeding with two projects in the Rocky Mountain Region of the U.S., with a combined total investment value of $2.4 billion. One project is located in Intel's Fab 12 Semiconductor Plant in Chandler, Arizona, and the second project will occur at Intel's Wafer Fab VIII in Colorado Springs, Colorado.

In Chandler, Arizona, Intel has selected IDC (Tempe, Arizona) and Hoffman Construction Company (Portland, Oregon) as the engineer and general contractor, respectively, for the project. Inside the two million square foot building, a 250,000 square foot clean room is being converted from a 200-mm fabrication facility to a 300-mm fabrication facility. Intel currently operates four other 300-mm plants; however this is the first time Intel has completely converted a 200-mm to a 300-mm fab facility. Construction began in the spring of 2004 and is expected to be complete by late 2005. Upon completion of the project, Intel's fifth 300-mm fabrication plant, the company will be able to improve its capital efficiency by significantly reducing production costs.

Intel has also announced plans to expand an existing facility in Colorado Springs, Colorado. The expansion includes the completion of a 66,000 square foot fab that was built, but not outfitted in 2000, when Intel came to Colorado Springs. Intel acquired the facility from Rockwell International in 2000 and expanded the footprint of the plant and began equipment installations to begin 300-mm CMOS (complementary metal oxide semiconductor) production. CMOS is a widely used type of semiconductor that uses both NMOS (negative polarity) and PMOS (positive polarity) circuits. Since only one of the circuit types is on at any given time, CMOS chips require less power than chips using just one type of transistor, which makes them particularly attractive for use in battery powered devices. Business for Intel then began to slow and they eventually suspended the remaining expansion plans, because of the economic downturn in 2001. The expansion will enable Intel to produce Wi-Fi chips for notebook computers, based its Centrino technology. Currently, the plant produces flash memory in an existing 200-mm fabrication facility. Construction began earlier this summer and is expected to be complete by the end of 2005.

Intel, the world's largest chipmaker, was founded in 1968 and has over 200 offices and production facilities worldwide. Since 1971, when they built the world's first microprocessor, Intel has continued to set the standards in research, design and manufacturing processes for the semiconductor industry. Through continuous investments in its facilities and production processes, Intel has continued remain ahead of the market trends, consumer demands and its competitors.

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